In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging
Author:
Affiliation:
1. Center for Device Thermography and Reliability (CDTR), University of Bristol, Bristol BS8 1TL, United Kingdom
Funder
Horizon 2020 Framework Programme
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaelm.1c01239
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3. Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications
4. Buttay, C.; Masson, A.; Li, J.; Johnson, M.; Lazar, M.; Raynaud, C.; Morel, H. Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization; HiTEN: Oxford, United Kingdom, https://hal.archives-ouvertes.fr/hal-00672619, July, 2011, pp 1–7.
5. Thermal management materials based on molybdenum (Mo) and copper (Cu): Elucidation of the rolling-induced evolution of thermo-physical properties (e.g. CTE)
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