Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique
Author:
Funder
National Natural Science Foundation of China
Shenzhen Science and Technology Innovation Committee
Publisher
Elsevier BV
Reference58 articles.
1. Nagrani, P. P.; Kulkarni, R. V.; Marconnet, A. M. In Influence of Thermal Cycling on Degradation Behavior of Thermal Greases, 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE: 2023; pp 01-10.
2. Berry, D. R.; Valenzuela, S. A.; Sootsman, J. R. In Reliability of Thermal Interface Materials in Combined Mechanical and Thermal Stress, 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE: 2023; pp 1-8.
3. Smith, A. N.; Jankowski, N.; Boteler, L.; Meyer, C. In Interfacial resistance measurement of high performance thermal interface materials, Heat Transfer Summer Conference, American Society of Mechanical Engineers: 2013; p V003T10A003.
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