Structural, mechanical, thermo-physical and electronic properties of η′-(CuNi)6Sn5 intermetallic compounds: First-principle calculations
Author:
Publisher
Elsevier BV
Subject
Inorganic Chemistry,Organic Chemistry,Spectroscopy,Analytical Chemistry
Reference35 articles.
1. Study of the Zn occupancy leading to the stability improvement for Cu6Sn5 using a first-principles approach
2. Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds
3. Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process
4. Effect of Zn Additions on the Mechanical Properties of Cu6Sn5-Based IMCs: Theoretical and Experimental Investigations
5. The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects
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1. Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound;Materials Today Communications;2024-03
2. Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations;Materials Characterization;2024-01
3. Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation;Materials Today Communications;2023-12
4. Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures;Vacuum;2023-11
5. The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases;Journal of Phase Equilibria and Diffusion;2023-06
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