Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures-Reference-Cited by-同舟云学术

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Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures

Published:2023-11 Issue: Volume:217 Page:112480
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Wang Rongyue^ORCID,Yuan Zhangfu^ORCID,Ma Bowen^ORCID,Mei Lu,Zhao Hongxin^ORCID,Xu Bingsheng

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference45 articles.

1. High-temperature lead-free solder alternatives;Chidambaram;Microelectron. Eng.,2011

2. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Wang;J. Mater. Sci. Mater. Electron.,2022

3. Effect of power cycling and heat aging on reliability and IMC growth of Sn-5Sb and Sn-10Sb solder joints;Kobayashi;Adv. Mater. Sci. Eng.,2018

4. Comparison of Sn-5Sb and Sn-10Sb alloys in tensile and fatigue properties using miniature size specimens;Kobayashi;Adv. Mater. Sci. Eng.,2018

5. Creep properties of Sn-Sb based lead-free solder alloys;El-Daly;J. Alloys Compd.,2009

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