Creep properties of Sn–Sb based lead-free solder alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Creep deformation characteristics of tin and tin-based electronic solder alloys
2. Lowering of Sn−Sb alloy melting points caused by substrate dissolution
3. Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin
4. Impression creep behavior of lead-free Sn–5Sb solder alloy
5. Creep deformation behavior of Sn-3.5Ag solder at small length scales
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