Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process
Author:
Publisher
Elsevier BV
Subject
Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science
Reference38 articles.
1. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
2. Effect of aging on fatigue crack growth at sn-pb/cu interfaces
3. Lead-free Solders in Microelectronics
4. Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints
5. Tin–lead (SnPb) solder reaction in flip chip technology
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1. Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint;Materials Today Communications;2024-03
2. Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates;Journal of Materials Science: Materials in Electronics;2023-07
3. A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering;Journal of Materials Science & Technology;2020-08
4. Interfacial Microstructure Evolution for Cu/Cu3Sn/Cu Solder Joints during Ultrasonic-Assisted TLP Soldering Process;2019 IEEE 21st Electronics Packaging Technology Conference (EPTC);2019-12
5. Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering;Scientific Reports;2019-10-16
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