Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation-Reference-Cited by-同舟云学术

Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation

Published:2023-12 Issue: Volume:37 Page:107427
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Xu Shan,Yang Ancang,Duan Yonghua,Li Mengnie,Peng Mingjun

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

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5. Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders;Xian;J. Alloy. Compd.,2015

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