Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference47 articles.
1. Nucleation control and thermal aging resistance of near-eutectic Sn–Ag–Cu-X solder joints by alloy design;Anderson;J. Electron. Mater.,2009
2. Kinetics of the polymorphic phase transformation of Cu6Sn5;Zeng;Acta Mater.,2014
3. The influence of Ni additions on the relative stability of eta and eta(‘) Cu6Sn5;Schwingenschlogl;Appl. Phys. Lett.,2010
4. Kinetics of the η–η′ transformation in Cu6Sn5;Nogita;Scr. Mater.,2011
5. Reactions of Sn–3.5Ag-based solders containing Zn and Al additions on Cu and Ni(P) substrates;Kotadia;J. Electron. Mater.,2010
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