Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference37 articles.
1. Solder Joint Technology: Materials, Properties, and Reliability,2007
2. Interfacial reactions between lead-free solders and common base materials
3. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures
4. IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
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