Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength-Reference-Cited by-同舟云学术

Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength

Published:2024-03 Issue: Volume:298 Page:109902
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Zhang Shuai,Zhou Hongzhi,Ding Tianran,Long Weimin,Zhong Sujuan,Paik Kyung-Wook,He Peng,Zhang Shuye^ORCID

Funder

Chongqing Natural Science Foundation

Key Laboratory of Silicon Device Technology

Xi'an Jiaotong University State Key Laboratory for Mechanical Behavior of Materials

Publisher

Elsevier BV

Reference41 articles.

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Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation on electromagnetic and heat transfer coupling of heating susceptor for selective microwave hybrid soldering: 3D multi-physics simulation and experiment;Applied Thermal Engineering;2024-10

2. Investigation on Electromagnetic and Heat Transfer Coupling of Heating Susceptor for Selective Microwave Hybrid Soldering: 3d Multi-Physics Simulation and Experiment;2024