Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
Author:
Funder
National Natural Science Foundation of China
University of Science and Technology Beijing
Fundamental Research Funds for the Central Universities
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference57 articles.
1. Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001) Cu/Sn/Ni micro solder joints;Lai;Mater. Charact.,2022
2. Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints;Jeong;J. Alloy Compd.,2022
3. Corrosion properties of Cu/Sn–3.0Ag–0.5Cu/Cu solder butt joints fabricated by conventional reflow and microwave hybrid heating;Said;Corros. Sci.,2022
4. Understanding and preventing Cu-Sn micro joint defects through design and press control;Njuki;J. Appl. Electrochem.,2022
5. Optimal doping elements for inhibiting surface-diffusion of adatoms on Cu3Sn;Dai;Appl. Surf. Sci.,2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3