Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints

Author:

Jeong Min-Seong,Lee Dong-Hwan,Yoon Jeong-Won

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference20 articles.

1. D. Choudhury, IEEE MTT-S International Microwave Symposium, 1–4, 2010.

2. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: an update on the effect of alternating current (AC) stressing;Zhu;Microelectron. Reliab.,2018

3. J. Lin, Y. Lei, Z. Wu, L. Yin, 11th International Conference on Electronic Packaging Technology and High Density Packaging, 1179–1182, 2010.

4. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009

5. Optical properties and electronic energy-band structure of CdIn2Te4;Ozaki;J. Mater. Sci. Mater. Electron.,2007

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