Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies-Reference-Cited by-同舟云学术

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Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

Published:2014-12 Issue: Volume:616 Page:394-400
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kim Mi-Song,Kang Myoung-Seok,Bang Jung-Hwan,Lee Chang-Woo,Kim Mok-Soon,Yoo Sehoon

Funder

Ministry of Trade, Industry & Energy and Korea Institute of Industrial Technology, Republic of Korea

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference21 articles.

1. Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

2. Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts;Journal of Welding and Joining;2024-08-31

2. Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics;Journal of Materials Science: Materials in Electronics;2024-04

3. Interfacial diffusion and Kirkendall voids evolution in the Copper-Zinc alloy binary interface revealed by in situ transmission electron microscopy;Journal of Alloys and Compounds;2023-12

4. Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding;Journal of Materials Science: Materials in Electronics;2023-03

5. Microstructure and mechanical properties of Sn-Ag-Cu/Sn-Pb hybrid solder joints with different Pb contents;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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