Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics
Author:
Funder
National Natural Science Foundation of China
Science and Technology Plan of Liaoning Province
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-12609-1.pdf
Reference17 articles.
1. M.L. Huang, F. Yang, Size effect model on kinetics of interfacial reaction between Sn–xAg–yCu solders and Cu substrate. Sci. Rep. 4, 7117 (2014). https://doi.org/10.1038/srep07117
2. M.S. Kim, M.S. Kang, J.H. Bang, C.W. Lee, S. Yoo, Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies. J. Alloys Compd. 616, 394–400 (2014). https://doi.org/10.1016/j.jallcom.2014.07.124
3. B. Nandagopal, Z.Q. Mei, S. Teng, Microstructure and thermal fatigue life of BGAs with eutectic Sn–Ag–Cu Balls assembled at 210 °C with eutectic Sn–Pb solder paste. IEEE Electron. Compon. Technol. Conf. (2006). https://doi.org/10.1109/ECTC.2006.1645759
4. L.Y. Gao, X.W. Cui, F.F. Tian, Z.Q. Liu, Failure mechanism of the SnAgCu/SnPb mixed soldering process in a ball grid array structure. J. Electron. Mater. 49(10), 6223–6231 (2020). https://doi.org/10.1007/s11664-020-08372-8
5. M.L. Huang, Q. Zhou, N. Zhao, X.Y. Liu, Z.J. Zhang, Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid-solid electromigration. J. Mater. Sci. 49(4), 1755–1763 (2014). https://doi.org/10.1007/s10853-013-7862-z
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