Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure-Reference-Cited by-同舟云学术

Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure

Published:2020-08-13 Issue:10 Volume:49 Page:6223-6231
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Gao Li-Yin,Cui Xian-Wei,Tian Fei-Fei,Liu Zhi-Quan^ORCID

Funder

National Key R&D Program of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-020-08372-8.pdf

Reference21 articles.

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3. A.R. Zbrzezny, P. Snugovsky, T. Lindsay, and R. Lau, IEEE Trans. Electron. Packag. Manuf. 29, 211 (2006).

4. Y. Huang, Z. Wu and Z. Liu, in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (2012), pp. 883–888.

5. Q. Jiang, W. Zhang, X. Wang, C. Yu, and G. Liu, Electron. Process Technol. 36, 73 (2015).

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