Reliability Investigation of Mixed BGA Assemblies-Reference-Cited by-同舟云学术

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Reliability Investigation of Mixed BGA Assemblies

Published:2006-07 Issue:3 Volume:29 Page:211-216
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Zbrzezny A.R.,Snugovsky P.,Lindsay T.,Lau R.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/36043/01707869.pdf?arnumber=1707869

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Single Factor Study of Solder Joint Reliability for MCP Packages;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

2. Effects of Reflow Peak Temperature and Reflow Times on Microstructure of the Mixed Lead-free BGA/Sn62Pb36Ag2 Solder Joints;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components;IEEE Journal of Selected Topics in Quantum Electronics;2021-11

4. Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test;Materials Research Express;2021-10-01

5. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure;Journal of Electronic Materials;2020-08-13

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