Microstructure and mechanical properties of Sn-Ag-Cu/Sn-Pb hybrid solder joints with different Pb contents
Author:
Affiliation:
1. Dalian University of Technology,Electronic Packaging Materials Laboratory, School of Materials Science & Engineering,Dalian,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872737.pdf?arnumber=9872737
Reference8 articles.
1. Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration
2. Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies
3. Microstructural investigation of lead‐free BGAs soldered with tin‐lead solder
4. Thermodynamic analysis of influence of Pb contamination on Pb-free solder joints reliability
5. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
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