Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Thermodynamic Study of the Phase Equilibria in the Sn-Ag-Bi-Cu Quaternary System
2. Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders
3. Interfacial reactions between lead-free solders and common base materials
4. Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging
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