Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture-Reference-Cited by-同舟云学术

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Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Published:2012-06 Issue:6 Volume:2 Page:979-984
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chang Jing-Yao,Cheng Ren-Shin,Kao Kuo-Shu,Chang Tao-Chih,Chuang Tung-Han

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6205691/06186893.pdf?arnumber=6186893

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fast low-temperature–pressure Cu-Sn mechanical interlock bonding (MIB) applied for 3D integration;Materials Letters;2023-11

2. Bonding of 5 μm Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10

3. Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection;Journal of Materials Science: Materials in Electronics;2021-04-19

4. Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps;Metals;2021-03-11

5. Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration;Microelectronic Engineering;2021-02

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