Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing-Reference-Cited by-同舟云学术

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Published:2010-07-21 Issue:10 Volume:39 Page:2281-2285
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kim Byoung-Joon,Lim Gi-Tae,Kim Jaedong,Lee Kiwook,Park Young-Bae,Lee Ho-Young,Joo Young-Chang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-010-1324-z.pdf

Reference21 articles.

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2. H.Y. Son, G.J. Jung, J.K. Lee, J.Y. Choi, and K.W. Paik, Proceedings of 57th Electronic Components and Technology Conference (ECTC) (2007), p. 864.

3. K.N. Tu, J.W. Mayer, and L.C. Feldman, Electronic Thin Film Science (New York: Macmillan, 1992).

4. K.N. Tu and R.D. Thompson, Acta Metall. 30, 947 (1982).

5. Y.C. Chan, C.K. Alex, J.K. So, and L. Lai, Mater. Sci. Eng. B 55, 5 (1998).

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