Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging-Reference-Cited by-同舟云学术

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Published:2011-08 Issue:33 Volume:509 Page:8441-8448
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Tsao L.C.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference33 articles.

1. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

2. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review

3. Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

4. Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

5. Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallization

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