Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallization
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference71 articles.
1. Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
2. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
3. Development of under bump metallizations for flip chip bonding to organic substrates
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