Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Properties of lead-free solder alloys with rare earth element additions
3. Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints
4. Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
5. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
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4. Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-04
5. Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples;Journal of the Taiwan Institute of Chemical Engineers;2024-02
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