Effects of Ti addition to Sn–Ag and Sn–Cu solders
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Lead (Pb)-free solders for electronic packaging
2. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
3. The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
4. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
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