Thermal, Microstructural, Wettability and Mechanical Properties of Sn1.0ag0.5cu Composite Solder Modified with Ti Nanoparticles

Author:

Wu Chuan Jiang,zhang liang,Chen Chen,Lu Xiao

Publisher

Elsevier BV

Reference44 articles.

1. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly;R M Shalaby;Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process,2017

2. Impact of Isothermal Aging on Mechanical Properties of 92;M M Hamasha;Cyclomax) Solder Joints,2023

3. Study on the floating kinetics of graphene in molten Sn-based alloy based on in-situ observation of X-ray radiography;Y Li;Compos. Pt. B-Eng,2022

4. Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders;O Krammer;Journal of Alloys and Compounds,2015

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