Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits-Reference-Cited by-同舟云学术

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Published:2012-01 Issue:2 Volume:60 Page:578-587
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Made Riko I,Gan Chee Lip,Yan Liling,Kor Katherine Hwee Boon,Chia Hong Ling,Pey Kin Leong,Thompson Carl V.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference41 articles.

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3. Ramm P, Klumpp A, Merkel R, Weber J, Wieland R, Ostmann A, et al. In: Materials research society symposium proceedings; 2003. p. 3–14.

4. Weber W. In: Materials research society symposium proceedings; 2007. p. 103.

5. Lu J, Cale T, Gutmann R. In: Materials for information technology; 2005. p. 405–17.

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