Author:
Li W.Y.,Chen C.T.,Ueshima M.,Kobatake T.,Suganuma K.
Funder
New Energy and Industrial Technology Development Organization
Daicel
Murata Science Foundation
Japan Society for the Promotion of Science
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
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3. Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism;Hou,2022
4. Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging;Liu;J. Mater. Res. Technol.,2022
5. Sintering of Advanced Materials: Fundamentals and Process,2010
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