Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition-Reference-Cited by-同舟云学术

Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

Published:2021-12 Issue: Volume:570 Page:151220
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Yuan Yulei,Wu Houya,Li Junjie,Zhu Pengli,Sun Rong

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference27 articles.

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