High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment-Reference-Cited by-同舟云学术

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High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Published:2007-08 Issue:3 Volume:30 Page:506-510
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Bai John Guofeng,Yin Jian,Zhang Zhiye,Lu Guo-Quan,van Wyk Jacobus Daniel

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4285919/04285921.pdf?arnumber=4285921

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