Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu–Cu Bonding
Author:
Affiliation:
1. Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
2. Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Funder
Semiconductor Research Corporation
National Science and Technology Council
Ministry of Education, Taiwan
Publisher
American Chemical Society (ACS)
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.cgd.3c00157
Reference45 articles.
1. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
2. Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
3. 3D Multi-chip Integration with System on Integrated Chips (SoIC™)
4. Study of 15µm pitch solder microbumps for 3D IC integration
5. Study on Ar(5%H2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Accelerated recrystallization of nanocrystalline films as a manifestation of the inner size effect of the diffusion coefficient;Vacuum;2024-08
2. Simultaneously performing interlayer copper interconnecting and TSV filling in stacked chips at room temperature based on copper electroplating;AIP Advances;2024-07-01
3. Influence of (1 1 1) texture on bonding strength in low-temperature bonding of nanotwinned Ag films: Experimental insights and void closure modeling;Materials & Design;2024-04
4. In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates;Acta Materialia;2024-04
5. Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations;Scientific Reports;2023-12-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3