1. Chanchani, Rajen, “An Overview of 3D Integration Technologies – Motivation, Options and Status,” Workshop on 3D Integration of Semiconductor Devices, in conjunction with Advanced Metallization Conference, sponsored by University of California, Berkeley, San Diego, October 18, 2004
2. Chanchani, Rajen, “3D Integration Technologies – An Overview”, Short course presented at Polytronics 2007 Conference, Tokyo, January16–18, 2007. 56th Electronic Component and Technology Conference, San Diego, CA, May 30–June 3, 2006
3. Saraswat, Krishna C. et al., Proceedings of The IEEE, Vol. 89, No. 5, May 2001, pp. 602–633
4. Davidson, E., Transactions IEEE-CPMT-B, Vol. 20, No. 4, 1967, pp. 361–374
5. Saraswat, Krishna C., “3-Dimensional ICs: Motivation, Performance Analysis and Technology,” Conference on 3D Architecture for Semiconductors and Packaging (sponsored by Research Triangle Institute), Burlingame, CA, April 14–15, 2004