Author:
Zhang Dingyou,Lu James J.-Q.
Publisher
Springer International Publishing
Reference73 articles.
1. Lu J-Q (2009) 3-D hyperintegration and packaging technologies for micro-nano systems. Proc IEEE 97:18–30
2. Lee SH, Chen K-N, Lu J-Q (2011) Wafer-to-wafer alignment for three-dimensional integration: a review. J Microelectromech Syst 20(4):885–898
3. Lu J-Q, McMahon J, Gutmann RJ (2012) Hybrid metal/polymer wafer bonding platform. In: Ramm P, Lu J-Q, Taklo MV (eds) Handbook of wafer bonding, 1st edn. Wiley-VCH, Weinheim, pp 215–236
4. Cho SD (2011) Technical challenges in TSV integration to Si. In: SEMATECH Symposium Korea, 2011, pp 1–33
5. Chen Q, Zhang D, Xu Z, Beece A, Patti R, Tan Z, Wang Z, Liu L, Lu J-Q (2011) A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment. Microelectron Eng 92:15–18
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