Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films-Reference-Cited by-同舟云学术

Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films

Published:2021-03 Issue: Volume:206 Page:116637
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Tseng I-Hsin,Hsu Yun-Ting,Leu Jihperng^ORCID,Tu K N,Chen Chih^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference36 articles.

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3. Effect of Joule heating and current crowding on electromigration in mobile technology;Tu;Appl. Phys. Rev.,2017

4. Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits;Liu;J. Appl. Phys.,2015

5. Large discrete resistance jump at grain boundary in copper nanowire;Kim;Nano Lett.,2010

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