Funder
Science Fund for Distinguished Young Scholars of Hunan Province
National Natural Science Foundation of China
East China University of Science and Technology
National Key Research and Development Program of China
Central South University
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference56 articles.
1. Electroless copper deposition: a critical review;Ghosh;Thin Solid Films,2019
2. Copper uses, resources, supply, demand and production information. 2023, https://geology.com/usgs/uses-of-copper/. Accessed 2023-09-05.
3. Current trends in patterning with copper;Rickerby;Chem. Rev.,2002
4. Modeling of abnormal grain growth in (111) oriented and nanotwinned copper;Gusak;Sci. Rep.,2021
5. Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures;Furuya,2012
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献