Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits
Author:
Affiliation:
1. Department of Materials Science and Engineering, UCLA, Los Angeles, California 90095-1595, USA
2. Qualcomm, San Diego, California 92121, USA
Funder
Qualcomm
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4932598
Reference16 articles.
1. Material innovation opportunities for 3D integrated circuits from a wireless application point of view
2. A metastable phase of tin in 3D integrated circuit solder microbumps
3. Reliability challenges in 3D IC packaging technology
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5. Behavior of electromigration‐induced gaps in a layered Al line observed by in situ sideview transmission electron microscopy
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