Material innovation opportunities for 3D integrated circuits from a wireless application point of view
Author:
Abstract
Publisher
Springer Science and Business Media LLC
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,General Materials Science
Reference17 articles.
1. 15. Nakamoto M. , Radojcic R. , Zhao W. , Dasarapu V. K. , Karmarkar A.P. , Xu X. , “Simulation Methodology and Flow Integration for 3D IC Stress Management,” paper presented at the Custom Integrated Circuits Conference (CICC), pp. 1–4 (San Jose, CA 2010).
2. 8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology
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