Low-temperature lead-free SnBiIn solder for electronic packaging
Author:
Funder
Science and Technology Innovation 2025 Major Project of Ningbo
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-12405-x.pdf
Reference29 articles.
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2. H.-Y. Huang, C.-W. Yang, Y.-C. Peng, Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium. Sci. Eng. Compos. Mater. 23, 641 (2015). https://doi.org/10.1515/secm-2014-0130
3. W.R. Osório, A. Garcia, Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys. Sci. Technol. Weld. Join. 21, 429 (2016). https://doi.org/10.1080/13621718.2015.1124176
4. T. An, F. Qin, Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectron. Reliab. 54, 932 (2014). https://doi.org/10.1016/j.microrel.2014.01.008
5. S.Q. Gu, Material innovation opportunities for 3D integrated circuits from a wireless application point of view. MRS Bull. 40, 233 (2015). https://doi.org/10.1557/mrs.2015.9
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1. Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder;Journal of Materials Science: Materials in Electronics;2024-06
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