Electro-Thermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects-Reference-Cited by-同舟云学术

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Electro-Thermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects

Published:2024 Issue: Volume: Page:1-1
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zhang Yiming¹^ORCID,Tian Wenchao²,Wang Hongyue¹^ORCID,Zhang Xiaowen¹,Shao Weiheng¹^ORCID,Zhou Bin¹,Shi Yijun¹,Gong Weixi¹,Deng Rui¹,Zhao Jianguo³,Wang Pan³,Feng Yang³

Affiliation:

1. Department of Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing, CEPERI, Guangzhou, Guangdong, China

2. Department of School of Electro-Mechanical Engineering, Xidian University, Xi’an, Shaanxi, China

3. Micro-Electronics Center of Chongqing United Micro-Electronics Center (CUMEC), Chongqing, China

Funder

Basic and applied basic research fund project of Guangdong Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/5673025/10363361.pdf?arnumber=10363361

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