Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy-Reference-Cited by-同舟云学术

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Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

Published:2015-02 Issue: Volume:67 Page:209-216
ISSN:0261-3069
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Yang Li,Zhang Yaocheng,Dai Jun,Jing Yanfeng,Ge Jinguo,Zhang Ning

Funder

National Natural Science Foundation of China

Science and Technology Program of Jiangsu Province of China

Science and Technology Program of Suzhou

Natural Science Foundation of the Jiangsu Higher Education Institutions of China

Scientific Research Project of Changshu Institute of Technology

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference32 articles.

1. Effect of Ni on growing of intermetallic compound in interface of Sn2.5Ag0.7Cu0.1RE/Cu solder joint during aging;Zhang;Mater Sci Technol,2012

2. Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications;Hammad;Mater Des,2013

3. Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni;Hammad;Mater Des,2013

4. Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co;Cheng;J Mater Sci,2008

5. Effects of minor Fe Co, and Ni additions on the reaction between SnAgCu solder and Cu;Wang;J Alloys Compd,2009

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1. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification;Journal of Electronic Materials;2024-04-10

2. Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate;Applied Sciences;2024-02-13

3. Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution;Microelectronics Reliability;2024-01

4. Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems;Physica Scripta;2023-10-11

5. Effect of temperature on the low cycle fatigue properties of BGA solder joints;Microelectronics Reliability;2023-07

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