Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
2. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
3. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
4. Proceeding of the 2006 Electronic Component and Technology Conference IEEE;Yu,2006
5. Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
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