Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference34 articles.
1. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate;Tay;Intermetallics,2013
2. Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions;El-Daly;Mater Des,2013
3. Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder;Yingxin;Electrochim Acta,2013
4. Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products;Shnawah;Microelectron Reliab,2012
5. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads;Gain;Intermetallics,2012
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