Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

Author:

Goh Yingxin,Haseeb A.S.M.A.,Sabri Mohd Faizul Mohd

Funder

Universiti Malaya

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference31 articles.

1. Electro-plating: A Survey of Modern Practice including the Analysis of Solutions;Field,1951

2. The High-Speed Electrodeposition of Sn-Pb Alloys;Kohl;Journal of the Electrochemical Society,1982

3. Effects of plating conditions on the microstructure of 80Sn–20Pb electrodeposits from an organic sulphonate bath;Kim;Surface and Coatings Technology,1996

4. Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps;Lin;IEEE Transactions on Advanced Packaging,1999

5. Effects of plating parameters on alloy composition and microstructure of Sn–Bi electrodeposits from methane sulphonate bath;Suh;Surface and Coatings Technology,2006

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