Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
Author:
Funder
Universiti Malaya
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference31 articles.
1. Electro-plating: A Survey of Modern Practice including the Analysis of Solutions;Field,1951
2. The High-Speed Electrodeposition of Sn-Pb Alloys;Kohl;Journal of the Electrochemical Society,1982
3. Effects of plating conditions on the microstructure of 80Sn–20Pb electrodeposits from an organic sulphonate bath;Kim;Surface and Coatings Technology,1996
4. Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps;Lin;IEEE Transactions on Advanced Packaging,1999
5. Effects of plating parameters on alloy composition and microstructure of Sn–Bi electrodeposits from methane sulphonate bath;Suh;Surface and Coatings Technology,2006
Cited by 68 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces;Metals;2024-08-25
2. All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints;Journal of Alloys and Compounds;2024-08
3. Gelatin Effects on the Kinetic of an Electrodeposition Process in Copper Foil Preparation;The Journal of Physical Chemistry C;2024-07-10
4. Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging;Soldering & Surface Mount Technology;2024-06-04
5. Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3