Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration-Reference-Cited by-同舟云学术

Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration

Published:2024-05-28 Issue: Volume:7 Page:506-513
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Chakraborty Souvik¹,Chen Yaxiong²,Sharma Gaurav²,Fahim Abdullah²,Hauck Torsten³,Das Ronit⁴,Mahmood Atif⁴,Suhling Jeffrey C.⁵,Borgesen Peter⁴

Affiliation:

1. Auburn University,Dept. of Mechanical Engineering,Auburn,AL,USA

2. NXP Semiconductors,Austin,TX,USA

3. NXP Semiconductors,Munich,Germany

4. Binghamton University,Dept. of Systems Science & Industrial Engineering,Binghamton,NY,USA

5. Auburn University,Dept. of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3),Auburn,AL,USA

Funder

Auburn University

NXP Semiconductors

Binghamton University

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565022.pdf?arnumber=10565022

Reference33 articles.

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4. The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints;Coyle

5. The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects;Burkholder