Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429735.pdf?arnumber=8429735
Cited by 37 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructural evaluation of interfacial intermetallic compounds between Sn58Bi and ENEPIG;Journal of the Taiwan Institute of Chemical Engineers;2024-06
2. Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder;Journal of Materials Science: Materials in Electronics;2024-06
3. Board Level Drop Reliability of Hybrid Solder Joints with Controlled Bismuth Mixing Ratio for Carbon Neutrality;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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