Board Level Drop Reliability of Hybrid Solder Joints with Controlled Bismuth Mixing Ratio for Carbon Neutrality-Reference-Cited by-同舟云学术

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Board Level Drop Reliability of Hybrid Solder Joints with Controlled Bismuth Mixing Ratio for Carbon Neutrality

Published:2024-05-28 Issue: Volume: Page:1473-1478
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Kim Seahwan¹,Min Kyung Deuk²,Jun Yoon Jae³,Noh Taejoon¹,Jung Seung-Boo¹

Affiliation:

1. Sungkyunkwan University,School of Advanced Materials Science and Engineering,Suwon,Republic of Korea

2. Samsung Electronics,Package Engineering Team, Test & System Package,Asan,Republic of Korea

3. Sungkyunkwan University,School of Semiconductor Convergence Engineering,Suwon,Republic of Korea

Funder

National Research Foundation of Korea

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565016.pdf?arnumber=10565016

Reference9 articles.

1. The application of Bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems;Mokler

2. Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

3. The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies

4. Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages

5. A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability;Materials Characterization;2024-10

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