The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies-Reference-Cited by-同舟云学术

The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies

Published:2020-09-30 Issue:1 Volume:50 Page:209-216
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Genanu Mohammed,Hadian Faramarz,Owen Randy,Cotts Eric J.^ORCID

Funder

Semiconductor Research Corporation

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-020-08474-3.pdf

Reference24 articles.

1. F. Wang, H. Chen, Y. Huang, L. Liu, and Z. Zhang, J. Mater. Sci. Mater. Electron. 30, 3222 (2019).

2. H. Fu, R. Aspandiar, J. Chen, S. Cheng, Q. Chen, R. Coyle, S. Feng, M. Krmpotich, R.C. Lasky, S. Mokler, and J. Radhakrishnan, Proceedings of SMTA International, pp. 207–220 (2017).

3. S. Sahasrabudhe, S. Mokler, M. Renavikar, S. Sane, K. Byrd, E. Brigham, O. Jin, P. Goonetilleke, N. Badwe, and S. Parupalli, in 2018 IEEE Electronic Components and Technology Conference (IEEE, 2018), pp. 1455–1464.

4. H. Fu, J. Radhakrishnan, M. Ribas, R. Aspandiar, B. Arfaei, K. Byrd, A. Caputo, J. Chen, Q. Chen, R. Coyle, D. Daily, and S. Feng, Proceedings of SMTA International, pp. 513–525 (2019).

5. S. Mokler, R. Aspandiar, K. Byrd, O. Chen, S. Walwadkar, K. Tang, M. Renavikar, and S. Sane, Proceedings of SMTA International, pp. 318–326 (2016).

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