Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages-Reference-Cited by-同舟云学术

Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lee Jihyun¹,Park Yongsung¹,Lee Junho¹,Lee Kangjoon¹,Ryu Hansung¹,Jung JeeHyun¹,Kim Kilsoo¹

Affiliation:

1. Samsung Electronics Co., Ltd,Gyeonggi-do,Hwaseong-si,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195338.pdf?arnumber=10195338

Reference8 articles.

1. Low Temperature Soldering: Thermal Cycling Reliability Performance;morgana;IPC APEX EXPO Conference,0

2. Interim Thermal Cycling Report on Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Joints;richard;Proceedings of SMTA International,0

3. The properties of tin-bismuth alloy solders

4. Thermodynamic assessments of the Sn-In and Sn-Bi binary systems

5. Mechanical Shock Testing and Failure Analysis on Mixed SnAgCu-BiSn and Full Stack BiSn Solder Joints of CABGA192 Components;haley;Proceedings of SMTA International,0

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