A Low-Cost, E-Band Surface Mounted Packaged Power Amplifier MMIC
Author:
Affiliation:
1. School of Electronic Information, Wuhan University,Wuhan,China,430072
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10380804/10380975/10381064.pdf?arnumber=10381064
Reference5 articles.
1. A Broadband E-band Driver Amplifier in 0.1 μm GaAs pHEMT Technology
2. Multi-Stage Gate Modulation of E-Band MMIC Power Amplifier for Efficiency Improvement
3. Broadband 32-Way E-Band Inline Power Combiner for High-Power MMIC Amplifiers
4. Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages
5. A Low-cost Surface-mountable Transition for High-speed Digital and Wideband Millimeter-wave Packaging Applications
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