Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference27 articles.
1. Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In;El-Daly;J Alloy Compd,2011
2. Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates;Kotadia;J Alloy Compd,2012
3. Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder;Chang;Mater Des,2011
4. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu;El-Daly;J Alloy Compd,2011
5. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging;Zhang;J Alloy Compd,2012
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1. Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying;Intermetallics;2024-10
2. Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium;Journal of Materials Science & Technology;2024-05
3. Improving the Thermal Aging Resistance and Tensile Strength of Sac305/Cu Solder Joints by Adding Bi, Sb, and Ni;2024
4. Improving the Thermal Aging Resistance and Tensile Strength of Sac305/Cu Solder Joints by Adding Bi, Sb, and Ni;2024
5. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder;Physics of Metals and Metallography;2023-12-29
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