Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution

Author:

Obaid Masoud GiyathaddinORCID,Erer Ahmet MustafaORCID

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

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3. Reduction of lead free solder aging effects using doped SAC alloys;Cai,2010

4. The effects of adding silver and indium to lead-free solders;Dharma;Weld. J.,2009

5. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R. Rep.,2000

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