Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Shnawah;Microelectron. Reliab.,2012
2. Mechanical characterization of Sn–Ag-based lead-free solders;Amagai;Microelectron. Reliab.,2002
3. Reduction of lead free solder aging effects using doped SAC alloys;Cai,2010
4. The effects of adding silver and indium to lead-free solders;Dharma;Weld. J.,2009
5. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R. Rep.,2000